For those most aware of what is happening in the tech industry, it will not be news that TSMC is currently the most important and sought-after chip maker in the world.
The Taiwanese company is also one of the most innovative, and the development of the N3E chips, of the 3 nm lithography, is advancing at full throttle. And according to the new information, mass production of these chips could happen throughout the second quarter of 2023.
TSMC's 3nm N3E chips could be mass-produced in 2023
According to the data revealed By the latest industry reports, TSMC's 3nm N3E manufacturing process is running smoothly. And if this lithograph was initially expected to arrive in early 2024, it seems that the new estimates point to the second quarter of 2023 as the expected date for the start of mass production of these components.
According to the details already known, the N3E manufacturing process will be about 8% less dense than the original N3. However, it will be 60% denser than the 5nm lithography. But the N3E process will be even more of a 3nm+ lithography, and will feature an EUV (Extreme Ultra Violet) design with fewer layers, which is supposed to reduce from 25 to 21 layers, which can make production easier.
According to the details, the initial production of these chips is expected to be between 10,000 and 20,000 wafers per month.
According to other data already revealed, the N3E process "features an improved manufacturing process with increased performance, power and output". As such, it is expected that this advanced lithography will be used in a number of innovative products in the future that seek to deliver a high level of performance.
From what is known, Apple will then be the biggest customer of TSMC's 3nm manufacturing process. But it is possible that some part of these chips will end up in Qualcomm's hands, since the North American's relationship with Samsung Foundry is no longer the best.